The SIM, soldered in.
An MFF2 embedded eSIM rated for heat, shock and vibration, with profiles provisioned and updated remotely. No tray, no swap, no field visits.
Made for hardware that lasts. Embedded IoT SIMs that solder into the board.
MFF2 form factor
A solderable chip that survives industrial temperatures, vibration and a 10+ year product life.
Remote provisioning
Load and change operator profiles over the air, long after the device is sealed and shipped.
Tamper resistant
The profile lives in a secure element, locked to the device and resistant to extraction.
IoT eSIM
Provisioned once it powers on.
Ship hardware with a blank or bootstrap profile and assign the real one remotely when it connects. Change carriers later without touching the device.
IoT eSIM at a glance.
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Industrial MFF2 (heat, shock, vibration)
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Over-the-air profile management
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GSMA remote provisioning
- 04
Locked to the secure element
Runs on every device you ship, from trackers and wearables to routers, cars and kiosks.
Global coverage190+ countries on one SIM
LTE-M coverageTrackers and wearables
NB-IoT coverageMeters and fixed sensors
Private wireless network coreIsolated, private traffic
TelematicsVehicles, dashcams and fleet units
LogisticsContainers, cargo and ports
Smart cityE-bikes, docks and street furniture
Access controlDoor readers and secure entry
Home and FWA routersFixed wireless broadband
Travel eSIMData for people on the move